Student Membership Benefits
The SMTA Connecticutcordially invites you to attend
a Chapter Technical Meeting
Key Technical Challenges and Process Improvements
For An Electronics Manufacturing Provider
Benchmark Electronics Inc.
New Hampshire Division
Robert Farrell
This study summarizes key technical challenges and process improvements for an Electronics Manufacturing Provider. The topics encompass SnPb, Hybrid (Pb-free BGA on a SnPb board), and Pb-free assembly for IPC Class 2 and 3 assemblies using No Clean and Water Soluble chemistries. Topics include the visual assessment of solder paste reflow for quality control and paste selection, assessment of X-Ray technology to count taped and reeled SMT parts, cleaning QFNs and other low standoff devices, cleaning no clean solder paste residues, assessment of a stencil design on a fine pitch assembly designed to eliminate a post screen print needle dispense of solder paste, BGA separation during 2nd pass reflow, eliminating unacceptable tarnish of silver boards during board bake, process improvements for hand soldering for assembly and rework, and the rework of BGAs and QFNS on high thermal mass boards with temperature sensitive optical fiber. Each topic will include a brief statement of the issue, solutions considered, applicable data, and assessment of the solution implemented.
Thursday, July 21, 2016
6:00-8:00 p.m.
Platform Specialty Products Corporation
Harold Leever Building
Ruth Ann Leever Training Center
245 Freight Street
Waterbury, CT 06702
Driving Directions
CLICK HERETO RSVP TODAY!
PRICE:
- SMTA member: Free
- Non-member: $10
About the speaker:
Bob has a Bachelors of Science in Mechanical Engineering from Union College, a Masters of Science in Mechanical Engineering from Worcester Polytechnic Institute, and a graduate nanotechnology certificate from the University of Massachusetts Lowell. He is an advanced development engineer and has been on the Benchmark Electronics corporate Pb-free team from 2003 to the present and has provided on site support to a number of Benchmark manufacturing facilities as they converted to Pb-free manufacturing.Bob has been an active member of the New England Lead Free Electronics consortium from 2004 until the present and has worked closely with the Center for Advanced Life Cycle Engineering (CALCE) based at the University of Maryland on a number of projects including PoP’s, alternative Pb-free alloys, and a nanotechnology based printed circuit board finish. He has extensive experience developing SnPb and Pb-free rework processes for through hole and BGA components.Bob is a co-author of Chapter 6 of the book “Green ElectronicsDesign and Manufacturing” by Dr Sammy Shina and he has made a number of technical presentations at IPC, IMAPS, SMTA, and CALCE conferences.
Contact Alexander Konefal at
or (203) 575-5711 with questions.