Operation of Denton DeskIISEMsamplecoater.

Sputtering of gold: for non-conductive samples for SEM imaging.

1.Lift sputter head and insert your sample(s). Replace head. Assure good seal on top and bottom of glass.

2.Turn on pump: small rocker switch on lower part of right side of cabinet. Evacuate to 30 mTorr or less. (Should take about 2 minutes) Open Ar cylinder and adjust outlet pressure to 5-10 psi, if necessary.

3.Press ETCH. Pressure will probably rise off scale, kicking off the etch light. Press again when pressure comes on scale.

4.After pressure drops below 50 mTorr, increase Ar flow by nopening GAS valve until pressure reads 125 -150 mTorr.

5.Move shutter knob fully counterclockwise, opening shutter. Return to cover sample holder pedestal.

6.Set current to zero. Set timer to 35 sec and press start. Immediately increase current to 5 mA (two segments illuminated). Return current setting to zero.

Carbon deposition: for non-conductive samples to be investigated by EDAX.

1.Lift sputter head and move to rear position. Install Carbon chamber and remove head. Replace carbon yarn if necessary: lift spring-loaded pins and insert yarn. Cut yarn with razor blade. Install head and pump.

2.Degas carbon yarn by raising temperature until color is bright red. (Note: this is a vacuum evaporation process, not sputtering. No Ar is used.)

3.Increase current to deposit carbon. Start with 10 A for 15 sec. Iterate. Remember that the deposition rate is related to the product of vapor pressure and time and the vapor pressure increases exponentially with temperature. If the yarn starts sparking before you quit, remove the yarn from the posts.

7.Reduce pressure to 50 mTorr. Move shutter to the rear, exposing sample. Press SPUTTER. Set timer to desired time. (Start with 30 sec.; iterate to optimum for your samples.)

8.Press START and immediately increase current to 45 mA. Monitor current during deposition...it seems not to be stable. Timer will automatically shut down system at end of prescribed time. Reduce current adjustment to zero. The thickness of your film is proportional to the product of time and current. adjust either to optimize film thickness.

9.Turn off mian power. It will simultaneously bleed the system up to atmospheric pressure. Remove sample and replace sputter head. Close Ar cylinder.