Anup kumar Keshri E-mail:
11295 NW 7th street, apt # 08, Miami, Florida- 33172, USA Mobile No.: +1-786-282-5879
To gain eminence as a full time professional & work in challenging position utilizing my flair for innovation, communication skills & team building skills.
Education:
· Florida International University, Florida, USA Joined on Fall' 06
Ph.D in Materials Science & Engineering GPA: 3.69 /4
· Indian Institute of Technology, Madras, India Graduation Date: Aug.’ 04
Master of Science in: Metallurgy & Materials Engg. GPA: 3.52 /4 Summer’ 04
· B.I.T Sindri, Dhanbad, Jharkhand, India
Bachelor of Engineering in: Metallurgical Engg. % Marks: 71 Summer ’ 02
Work Experience:
· Asst. Manager, R&D & Six-Sigma Team, Ispat Industries limited, Maharastra, India Aug ‘ 04 – Aug ‘06
· Graduate Assistant of Research, Shape Memory Alloy Research Team, Materials Engg. Aug. ’02 – Aug.’04
Trained on the following equipments:
Optical Emission Spectrometry (O.E.S) Optical Image Analyzer Differential Scanning Calorimetry (D.S.C) Transmission Electron Microscopy (T.E.M) Xray Diffraction (X.R.D) Hardness & Ductility test frames
Papers in Peer Reviewed Journals:
· K. Balani, S. P. Harimkar, A. Keshri, Y. Chen, N. B. Dahotre and A. Agarwal, Acta Materialia, Vol. 56, Issue 20, Dec.
2008, pp: 5984-5994.
· A. K. Keshri, S. R. Bakshi, Y. Chen, T. Laha, X. Li, C. Levy and A. Agarwal, Surface Engineering, Vol. 25, No. 4, 2009
pp: 270-275
· A. K. Keshri, K. Balani, S. R. Bakshi, V. Singh, T. Laha, S. Seal, A. Agarwal, Surface & Coatings Technology 203
(2009) 2193–2201
· Y. Chen, S. Omar, A.K. Keshri, K. Balani, K. Babu, J.C. Nino, S. Seal and A. Agarwal, Scripta Materialia 60
(2009) 1023–1026
· S. R. Bakshi, A. K. Keshri, V. Singh, S. Seal, and A. Agarwal, Journal of Alloys and Compounds
doi:10.1016/j.jallcom.2009.03.055
Conference Proceeding Publications:
1. Anup Kumar Keshri, Paramanand Singh, and Uday Chakkingal “Effect of heat treatment on the characteristics of Cu-Al-Ni
shape memory alloys”. Proc. International Conference on Heat Treatment, Jan 2004, Chennai, pp. A2, 1-5.
2. Anup Kumar Keshri Paramanand Singh, and Uday Chakkingal “Cu-Al-Ni as Smart Materials as an Automotive
Applications”. Proc. International Conference on Transmat Expo-2004, Nov. 2004, Mumbai, pp 36-37
3. Anup Kumar Keshri, Paramanand Singh, and Uday Chakkingal “Effect of compositions on Cu-Al-Ni
shape memory alloys”. Proc. International Conference on ISRS conference, Dec 2004, Chennai. pp. 1-7.
Internships:
Study of the Entire process of steel Making
Rigrous Training of 32 days in Bokaro Steel Plant, Bokaro, Jharkhand, India
Enhancement of EBT life of Electric Arc Furnace
Increased the life of EBT from 118 heats to 145 heats, Ispat Industries Limited, Maharastra, India
Study of EBT filling mass of Electric Arc Furnace
Earlier the Consumption of EBT filling mass was 1.8 K.g/Tls but I reduced it to 1.2 K.g/Tls, Ispat Industries limited, Maharastra, India.
Academic Projects:
· Fabrication and Characterization of PZT patch by Plasma Spraying (US Army Project)
· Synthesis of Al-based Bulk Metallic Glass via Plasma Spraying route
· Liquid Precursor Plasma Spraying of Alumina powder
· Enhancement of properties of Cu-Al-Ni shape memory alloy by Alloying and thermo-mechanical Processing. (M.S Project)
· Application of Rheocasting in Ingot Casting, (Bachelor of Engineering)
Honours &Achievements
· Serving as a Secretary of Material Advantage chapter at FIU, Miami, Florida, USA
· Arthur E. Focke leadership award by ASM Foundation for attending the leadership camp during Summer-2008 at University of Illinois, Urbana Champaign.
· Delegates of “President’s Council of Student Advisors (PCSA)” formed by The American Ceramic Society (ACerS)
· Executive member of Cry America.
· Served as an Executive Committee Member, Indian Society of Techanical Education, B.I.T Sindri Chapter, India
· Secured 1st Position in Regional Technical presentation competition organized by Material Advantage at FIU, on 16th Nov.
2007.
· Secured 3rd Position Oral presentation competition organized by Material Advantage at FIU, on 13th April. 2007.
· Secured 1st Position in Poster competition organized by Material Advantage at FIU, on 17th Nov. 2006.
· Developed Cu-Al-Ni shape memory alloy with enhanced mechanical properties in IIT Madras.
· Got Best Paper presentation award in an International Conference on Nov’04.
· Made a record in IIT Madras for finishing the Research work within the excellent time period.
· “Mr. Anup makes ISPAT proud” one article came in ISPAT HR buzz Dec ’04 issue. This was my biggest achievement.
Computer Skills:
Packages: Adobe Photoshop, MS Office (Word, Excel, Power Point, Access)
Programming languages: C, C++, Fortran
References
Dr. Arvind Agarwal Dr. Paramanand Singh
Associate Professor Professor
Dept. of Mechanical & Materials Engg. Dept. of Metallurgical & Materials Engg.
Florida International University, Miami, FL, USA IIT Madras, Chennai, India
Email: Email: