Wisconsin Center for Applied Microelectronics

1550 Engineering DrivePhone: 608/262-6877

Madison, WI 53706Fax: 608/265-2614

Tencor FLX-2320

Thin Film Stress Measurement

Rev. 8/27/2010

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Material Restrictions:

All materials allowed for use in this equipment are listed in PDF form on the WCAM My Web Space. To view the listing following these steps:

  1. Open the UW website for My WebSpace.
  2. Log on using your UW NetID and password.
  3. Click on the star in the upper left corner.
  4. Under Bookmarks click on Group Directories.
  5. Scroll down the list of organizations to WCAM.
  6. Click on WCAM.
  7. Double click on the first file folder to open “Approved Materials.”
  8. Double click on the WebsiteRpt to view the approved materials for equipment.
  9. Within the PDF you can perform a search.

QUICK START to Tencor FLX-2320

Thin Film Stress Measurement

NOTES:

User needs 3.5” diskette for saving data files.

  • The complete manual is available.

Pre-Check

  1. Turn ONMAIN switch of instrument located right on top panel.
  2. Power ON to separate computer.
  3. Turn ONNitrogen by turning valve in-line.

1st Measurement – Before Thin Film

  1. Open instrument and place appropriate sized wafer ring on stage with the notch towards user.
  2. Center wafer on ring with flat at the ring notch.
  3. At the computer, enter the FLEXUS software. Click on USER 1.
  4. To check laser intensities:
    Under UTILITIES in main menu choose PC PORTS DIAGNOSTICS.
    670m Laser should read approximately SUM = 2.6 DIFF = 0.0 _ _
    750m Laser should read approximately SUM = 3.0 DIFF = 0.0 _ _
    If values are within range, exit DIAGNOSTIC screen. If not, SEE STAFF.
  5. At main menu, choose MEASURE and in the submenu choose First (No Film).
  6. On the First Measurement screen:
    A. Check Process Program. To alter, from EDIT main menu choose PROCESS
    PROGRAMS.
    B. Name the FILE indicating A:\ as designated directory.
    Or you can click on the FILES button.
    C. Type an ID.
    D. Add ORIENATION and COMMENTS if needed.
    E. Click on the MEASURE button to execute.
  7. For additional orientations, reposition wafer ring, edit First Measurement screen, and click MEASURE button.
  8. When first measurements are complete, exit software and turn off nitrogen.

Measurement – After Thin Film Deposition

  1. Perform Pre-check and enter software.
  2. Position sample on wafer ring.
  3. From the MEASURE Main Menu choose from the following:
    Single Stress  measurement after deposition[Section 4.1.3]
    Stress – Time  measurement after deposition by time[Section 4.1.4]
    Stress – Temp  measurement after deposition by temperature[Section 4.1.5]
  4. When first measurements are complete, exit software and turn off nitrogen.

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StressMeasurement.doc