PMT Base High Voltage Power SupplyPage 1 of 59
Document # 9000-0039-01Revision: draft
REVISIONSLTR. / ECN / DESCRIPTION / DATE / APPROVED
- / NA / Original release / yy7/26/02/mm/dd
SHEET REVISION STATUS
SHEET / 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 / 9 / 10 / 11 / 12 / 13 / 14 / 15 / 16 / 17 / 18
REVISION / - / - / - / - / - / - / - / - / - / - / - / - / - / - / - / - / - / -
SHEET / 19 / 20 / 21 / 22 / 23 / 24 / 25 / 26 / 27 / 28 / 29 / 30 / 31 / 32 / 33 / 34 / 35 / 36
REVISION / - / - / - / -
SHEET / 37 / 38 / 39 / 40 / 41 / 42 / 43 / 44 / 45 / 46 / 47 / 48 / 49 / 50 / 51 / 52 / 53 / 54
REVISION
SHEET / 55 / 56 / 57 / 58 / 59 / 60 / 61 / 62 / 63 / 64 / 65 / 66 / 67 / 68 / 69 / 70 / 71 / 72
REVISION
SHEET / 73 / 74 / 75 / 76 / 77 / 78 / 79 / 80 / 81 / 82 / 83 / 84 / 85 / 86 / 87 / 88 / 89 / 90
REVISION
SHEET / 91 / 92 / 93 / 94 / 95 / 96 / 97 / 98 / 99 / 100 / 101 / 102 / 103 / 104 / 105 / 106 / 107 / 108
REVISION / A / A / A / -A / -A / - / - / - / - / -
CONTROLLED DIST. LIST / THE UNIVERSITY OF WISCONSIN
1 / 16 / ANTARCTIC ASTRONOMY AND ASTROPHYSICS
2 / 17 / RESEARCH INSTITUTE
3 / 18 / MADISON, WISCONSIN
4 / 19 / TITLE
5 / 20 / ICECUBE
6 / 21 / PMT BASE HIGH VOLTAGE POWER SUPPLY
7 / 22 / REQUIREMENTS DOCUMENT
8 / 23 / ORIGINATOR / DATE / ENGINEER / DATE / CHECKER / DATE
9 / 24 / NK yy/mm/dd / RI yy/mm/dd / N/A yy/mm/dd
10 / 25 / LEVEL 2/LEAD / DATE / PRODUCT ASSURANCE / DATE / PROJECT APPROVAL / DATE
11 / 26 / AK yy/mm/dd / TAD yy/mm/dd / RP yy/mm/dd
12 / 27 / FILENAME8510-0105.020926.doc / PROJECT NO.8510
13 / 28 / 9000-0039.yymmdd.doc / 9000
14 / 29 / DRAWING NO.268510-0105 / SCALE / SIZE / SHEET
15 / 30 / 9000-9939-01 / NA / A / Page 1 of 55910
PMT Base HV Pwr Sply DraftK.doc
PMT Base High Voltage Power SupplyPage 1 of 59
Document # 9000-0039-01Revision: draft
Table of Contents
1INTRODUCTION......
1.1Purpose......
1.2Scope......
1.3Responsibility and Records......
1.4Item’s Function in the IceCube System......
2APPLICABLE DOCUMENTS......
2.1Government Requirements......
2.2University Policy Requirements......
2.3Industry Requirements......
2.4Certifications and Approvals......
2.5Project Requirements......
2.6Reference Documents......
2.7Order of Precedence......
3REQUIREMENTS......
3.1Item Identification......
3.1.1Definition......
3.1.2Functional Description......
3.1.3Functional Block Diagram......
3.1.4Functional External Interfaces......
3.2Performance Requirements......
3.2.1Functional Requirements......
3.2.1.1High Voltage Generation......
3.2.1.2PMT Signal Output......
3.2.1.3Command Response......
3.2.1.4High Voltage Readings Output......
3.2.1.5Board Identification Output......
3.2.2Electrical Requirements......
3.2.2.1Input Voltage......
3.2.2.1.1+5 Volts DC......
3.2.2.1.2–5 Volts DC......
3.2.2.2Input Current......
3.2.2.2.1+5 Volts Input Current......
3.2.2.2.2–5 Volts Input Current......
3.2.2.3Input Power......
3.2.2.4Internal Power Distribution......
3.2.2.5Internal Grounds......
3.2.2.5.1Analog Ground......
3.2.2.5.2Power and Digital Grounds......
3.2.2.5.3Split Power/Digital and Analog Grounds......
3.2.2.5.3.1Isolated Grounds Configuration......
3.2.2.5.3.2Isolation Resistance......
3.2.2.5.3.3Stray Capacitance......
3.2.2.5.3.4Noise Tuning Grounds Interconnect Jumper......
3.2.2.5.3.5Soldering Pad for Clean Analog Ground......
3.2.2.5.4RF Grounds......
3.2.2.6PMT Cathode......
3.2.2.6.1PMT Cathode Potential......
3.2.2.6.2PMT Cathode Ground Reference......
3.2.2.7PMT Anode High Voltage Generation......
3.2.2.7.1Adjustable Voltage Range......
3.2.2.7.2Minimum Adjustment Voltage......
3.2.2.7.3Maximum Adjustment Voltage......
3.2.2.7.4Voltage Adjustment DAC Resolution......
3.2.2.7.5Voltage Adjustment Linearity......
3.2.2.8High Voltage Quality......
3.2.2.8.1Voltage Stability......
3.2.2.8.2Anode Voltage Ripple (Noise)......
3.2.2.9Anode Voltage Monitoring......
3.2.2.9.1Voltage Monitoring Output......
3.2.2.9.2Voltage Monitoring ADC Resolution......
3.2.2.9.3Voltage Monitoring Linearity......
3.2.2.10Anode Current Sourcing Capability......
3.2.2.10.1Current Sourcing at Minimum Operating Temperature......
3.2.2.10.2Current Sourcing at Maximum Operating Temperature......
3.2.2.10.3Pulsed Current Sourcing......
3.2.2.11PMT Dynode and Focus Voltages......
3.2.2.11.1Dynode Chain Voltage Distribution......
3.2.2.11.2Voltage Source Impedance......
3.2.2.11.3First Dynode (Dy1) Factory Default Voltage......
3.2.2.11.4First Dynode (Dy1) Field Voltage Adjustment......
3.2.2.11.5PMT Focus Voltages......
3.2.2.12Dynode Damping Resistors......
3.2.2.12.1HV Damping Resistors......
3.2.2.12.2Resistor Value......
3.2.2.12.3Resistor Accessibility......
3.2.3Mechanical Requirements......
3.2.3.1Force Inputs......
3.2.3.1.1Linear......
3.2.3.1.2Rotational......
3.2.3.2Force Outputs......
3.2.3.2.1Linear......
3.2.3.2.2Rotational......
3.2.3.3Loading......
3.2.3.3.1Structural Load......
3.2.3.3.2Tensile Strength......
3.2.3.3.3Compressive Strength......
3.2.3.3.4Elasticity......
3.2.3.3.5Compressibility......
3.2.3.4Thermal Transfer......
3.2.4Mass Properties Requirements......
3.2.4.1Size......
3.2.4.2Shape......
3.2.4.3Weight......
3.2.4.4Center of Gravity......
3.2.4.5Momentum......
3.2.5External Interface Requirements......
3.2.5.1Electric Power......
3.2.5.2Discrete Signals......
3.2.5.2.1High Voltage ON/OFF......
3.2.5.2.1.1High Voltage ON/OFF Control......
3.2.5.2.1.2High Voltage ON/OFF Signal Logic Level......
3.2.5.3Analog Signals......
3.2.5.3.1Grounding Wire Interface to the DOM Main Board......
3.2.5.3.2PMT Output Voltage......
3.2.5.4Digital Signals......
3.2.5.4.1Digital Signal Definitions......
3.2.5.4.1.1CMOS Standard......
3.2.5.4.2High Voltage Control......
3.2.5.4.2.1HV Adjustment Digital Command Code......
3.2.5.4.2.2HV Monitoring Digital Output Code......
3.2.5.4.3Chip Select......
3.2.5.4.3.1Chip Select Signals (CS0, CS1)......
3.2.5.4.3.2Chip Selection Codes......
3.2.5.4.4MOSI, MISO, and SCLK Signals......
3.2.5.4.4.1DAC Signals......
3.2.5.4.4.2ADC Signals......
3.2.5.4.4.3IDENT Signals......
3.2.5.4.5Board Digital Identification......
3.2.5.4.5.1Board Digital Identification Number......
3.2.5.4.5.2Board Identification Protocol......
3.2.5.5RF Signals......
3.2.5.6Fiber Optic Signals......
3.2.5.7External Grounding......
3.2.5.7.1Discrete Signal Grounding......
3.2.5.7.2Analog Signal Grounding......
3.2.5.7.3Digital Signal Grounding......
3.2.5.7.4RF Signal Grounding......
3.2.5.7.5Secondary Power Grounding......
3.2.5.7.6Primary Power Grounding......
3.2.5.7.7High Energy Grounding......
3.2.5.7.8Safety Grounding......
3.2.5.8Test and Maintenance......
3.2.5.8.1Test Points......
3.2.5.8.2Access (Doors, Panels, etc.)......
3.2.5.9Interconnections......
3.2.5.9.1Cables and Harnesses......
3.2.5.9.1.1Cable Interface - PMT HV Board to DOM Main Board......
3.2.5.9.1.2Signal Duplication – PMT HV Board to DOM Main Board......
3.2.5.9.1.3Cable Type - PMT HV Board to DOM Main Board......
3.2.5.9.2Connectors......
3.2.5.9.2.1PMT HV Board to DOM Main Board Cable Type......
3.2.5.9.2.2Connector Locations......
3.2.5.9.2.3Other Connector Locations......
3.2.5.9.3Summary of PMT HV Board Interface Cables......
3.2.5.9.4Pin Outs......
3.2.5.9.4.1Ribbon Cable Connector Pin Assignments......
3.2.5.9.4.2Board Connector Physical Pin Layout......
3.2.5.9.4.3PMT Pin Assignment......
3.2.5.10Grasping/Mounting Points......
3.2.5.10.1Production......
3.2.5.10.1.1PMT Collar Positioning Pins Clearance......
3.2.5.10.1.2PMT HV Board Mounting to PMT......
3.2.5.10.2Shipping Transport......
3.2.5.10.3Installation......
3.2.5.11Human......
3.2.5.12Solar......
3.2.5.13Thermal......
3.2.5.14Optical......
3.2.5.15Photonic......
3.2.5.16Hydraulic......
3.2.5.17Pneumatic......
3.2.6Environmental Requirements......
3.2.6.1Temperature......
3.2.6.1.1Operating Temperature......
3.2.6.1.2Non-Operating Temperature......
3.2.6.1.3Storage/Transport Temperature......
3.2.6.2Thermal Shock......
3.2.6.2.1Operating Thermal Shock......
3.2.6.2.2Non-Operating Thermal Shock......
3.2.6.2.3Storage/Transport Thermal Shock......
3.2.6.3Pressure......
3.2.6.3.1Operating Pressure......
3.2.6.3.2Non-Operating Pressure......
3.2.6.3.3Storage/Transport Pressure......
3.2.6.4Vibration......
3.2.6.4.1Operating Vibration......
3.2.6.4.2Non-Operating Vibration......
3.2.6.4.3Storage/Transport Vibration......
3.2.6.5Mechanical Shock......
3.2.6.5.1Operating Mechanical Shock......
3.2.6.5.2Non-Operating Mechanical Shock......
3.2.6.5.3Storage/Transport Mechanical Shock......
3.2.6.6Acoustic Vibration......
3.2.6.6.1Operating Acoustic Vibration......
3.2.6.6.2Non-Operating Acoustic Vibration......
3.2.6.6.3Storage/Transport Acoustic Vibration......
3.2.6.7Electromagnetic Interference/Compatibility......
3.2.6.7.1Conducted Energy......
3.2.6.7.2Susceptible to Conducted Energy......
3.2.6.7.3Radiated Energy......
3.2.6.7.4Susceptible to Radiated Energy......
3.2.6.8Electrostatic Discharge......
3.2.6.9Lightning and EMP......
3.2.6.10Sand and Dust......
3.2.6.11Humidity......
3.2.6.12Radioactivity......
3.2.7Built-in Test Diagnostics......
3.2.8Flexibility and Expansion......
3.2.9Portability......
3.2.10Transportability......
3.2.11Storage......
3.3Design and Construction Requirements (parts, materials, and processes)......
3.3.1Electrical Parts (wire, connectors, solder, insulation, switches, batteries, etc.)....
3.3.2Electronic Parts (resistors, capacitors, inductors, semiconductors, tubes, etc.)....
3.3.2.1PMT Signal Output Transformer......
3.3.2.1.1Transformer Signal Definition......
3.3.2.1.2Transformer Construction......
3.3.2.1.2.1Coaxial Wound Toroid......
3.3.2.1.2.2Coaxial Cable Type
3.3.2.1.2.3Toroidal Core Type
3.3.2.1.2.4Winding Retention......
3.3.2.1.3Primary Side Requirements......
3.3.2.1.3.1Primary Resistor Termination......
3.3.2.1.3.2PMT Anode Primary Termination......
3.3.2.1.3.3PMT Anode High Voltage Primary Termination......
3.3.2.1.4Secondary Side Requirements......
3.3.2.1.4.1Coaxial Output Secondary Interface......
3.3.2.1.4.2Output Coax Type......
3.3.2.1.4.3Output Coax Secondary Connections......
3.3.2.1.5Coaxial Cable Installation......
3.3.2.1.5.1Coax Cable Delivery With PMT HV Board......
3.3.2.1.5.2Soldered Coax Connections......
3.3.2.1.5.3Electrical Connections Mechanical Integrity......
3.3.2.1.5.4Length of Coax Cable......
3.3.2.1.5.5Coax Cable Free End Connector......
3.3.2.1.5.6Coax Connector Type......
3.3.3Mechanical Parts (structures, fasteners, holders, containers, valves, etc.)......
3.3.4Coatings, Platings, Corrosion Prevention......
3.3.5Adhesives and Sealants......
3.3.6Printed Circuit Boards......
3.3.6.1PMT HV Board Layout......
3.3.6.1.1Definition......
3.3.6.1.2Component Placement......
3.3.6.1.3Excluded Area......
3.3.6.1.4Minimum Trace Spacing Requirements......
3.3.6.1.5Plated-thru Holes......
3.3.6.1.6Hole Pattern......
3.3.6.1.7Annular Ring......
3.3.6.2Manual Soldering Compatibility......
3.3.6.3Solder Mask......
3.3.6.4Silk Screen Marking......
3.3.6.5Conformal Coating......
3.3.7Soldering......
3.3.8Welding......
3.3.9Machining......
3.3.10Restricted Parts, Materials and Processes......
3.3.10.1Beryllium......
3.3.10.2Cadmium......
3.3.10.3CFC......
3.3.10.4Lead......
3.3.10.5Mercury......
3.3.11Reliability......
3.3.12Maintainability......
3.3.13Interchangeability......
3.3.14Manufacturability......
3.3.15Workmanship......
3.3.16Human Engineering......
3.4Quality Requirements......
3.5Safety Requirements......
3.5.1Personnel......
3.5.2Equipment......
3.5.3Environment......
3.6Special Test Equipment......
3.6.1Engineering......
3.6.2Production......
3.6.3Field......
3.7Tools, Jigs, and Fixtures......
3.7.1Engineering......
3.7.2Production......
3.7.3Shipping......
3.7.4Logistics......
3.7.5Deployment......
3.7.6Installation......
3.8Support......
3.8.1Logistics......
3.8.2Preventative Maintenance......
3.8.3Special Tools......
3.8.4Spares......
3.8.5Repair Methods......
3.8.6Documentation/Manuals......
3.9Personnel and Training......
3.10End of Life Disposition......
3.10.1Retirement......
3.10.2Disposal......
3.11System Security......
4VERIFICATION......
4.1Responsibility......
4.2Special Tests and Examinations......
4.3Requirement vs. Verification Cross Reference with Section 3......
5PREPARATION FOR DELIVERY......
5.1Identification Nameplates and Marking......
5.1.1Part and Serial Numbers......
5.1.2Nameplate......
5.1.3Cable and Connector ID Tags......
5.2Acceptance Inspection and Tests......
5.3Packaging......
5.4Recording Sensors......
5.5Crating......
5.6Labeling......
5.7Shipping......
6DEFINITIONS......
6.1IceCube Acronyms......
6.2IceCube Glossary......
7APPENDIX......
PMT Base HV Pwr Sply DraftK.doc
PMT Base High Voltage Power SupplyPage 1 of 59
Document # 9000-0039-01Revision: draft
1INTRODUCTION
1.1Purpose
This IceCube Engineering Requirements Document (ERD) specifies the functional, constraint, and verification requirements for the PMT Base High Voltage Power Supply Configuration Item (CI) including the source traceability (justification) for each requirement.
1.2Scope
This requirements document shall be applicable to the design, development, integration, verification, production, logistics, field deployment and disposal of the PMT Base High Voltage Power Supply.
1.3Responsibility and Records
Physics/Engineering is responsible for writing and updating these requirements to ensure they are correct, complete and current. Changes to this document shall be via Engineering Change Notices (ECN’s) to be approved prior to incorporation according to the IceCube Configuration Management Plan, [TBD document]. Quality Assurance is responsible for ensuring this document and changes to it are properly reviewed, approved and maintained.
1.4Item’s Function in the IceCube System
The PMT (Photomultiplier Tube) High Voltage (HV) Board is a modular printed circuit board (PCB) power supply that creates and supplies approximately 2000 volts anode bias to the PMT inside each Digital Optical Module (DOM). The PMT HV Board also supplies multiple bias high voltages to the PMT dynodes. This high voltage provides acceleration and focusing of electrons inside the PMT that flow in response to impinging photons from a nearby photonic event. This electron flow is the sole detection mechanism for the IceCube system. There are 4800 Digital Optical Modules in the IceCube system, each containing a PMT HV Board. The Digital Optical Modules are deployed into deep Antarctic ice for scientific research.
2APPLICABLE DOCUMENTS
The following documents of the exact issue shown are applicable requirements for this Configuration Item only to the extent they are invoked by specific requirements herein.
2.1Government Requirements
{National Science Foundation, xxxxxxxx}
{Occupational Safety and Health Administration, xxxxxxxx}
{Federal Communications Commission, xxxxxxxx}
{Federal Aviation Administration, xxxxxxxx}
{Customs – import/export}
{Hazardous materials storage and handling}
{International Trafficking in Arms Regulation (ITAR)}
{Standard government test methods}
{Regulations for packing and shipping to Antarctica}
{Etc.}
2.2University Policy Requirements
{Personnel and equipment safety}
{Test equipment calibration}
{Hazardous material storage and handling}
{Protecting intellectual property}
{Etc.}
2.3Industry Requirements
{ASTM, ASME, EIA, NEC, ANSI, IEEE, JDEC, NFPA}
{Building codes}
{Standard on printed wiring board design}
{Standard test methods}
{Standard for soldering}
{Packing and shipping containers for commercial shipping}
{Etc.}
2.4Certifications and Approvals
{Underwriters Laboratory, xxxxxxxx}
{European Union CE Marking, EC Directive xx/xx/EEC}
{Etc.}
2.5Project Requirements
PMT HV Board Dimensional and Component Placement Requirements, PSL 5549B020 Rev ?, Physical Sciences Lab, University of Wisconsin - Madison
Component Envelope Drawing, PSL 5549C021 Rev G, Physical Sciences Lab, University of Wisconsin - Madison
{Top level IceCube System specification, Document No. 9000-xxxx}
{Interface Requirements, Document No. 9000-xxxx}
{Etc.}
2.6Reference Documents
{Reports or analyses from associated, similar or prior projects}
{Textbooks, symposia proceedings, or other associated references of record}
{White papers relating to the CI specified in this document}
{Etc.}
2.7Order of Precedence
Conflicts within this document shall be resolved as directed by the IceCube System Engineer in collaboration with the Project Lead responsible for this Configuration Item.
In the event of a conflict between this document and any other documents, this document shall govern. An annotation of the nature of the conflict shall be placed in this document.
Conflicts between other documents as they relate to or impact this document shall be resolved as directed by the IceCube Project Manager in collaboration with the IceCube System Engineer.
3REQUIREMENTS
3.1Item Identification
3.1.1Definition
The PMT (Photomultiplier Tube) High Voltage (HV) Board is a modular printed circuit board (PCB) high voltage power supply mounted inside a Digital Optical Module (DOM).
3.1.2Functional Description
The PMT (Photomultiplier Tube) High Voltage (HV) Board is a power supply that creates and supplies approximately 2000 volts DC anode bias to the PMT inside each Digital Optical Module (DOM). The PMT HV Board also supplies multiple DC bias high voltages to the PMT dynodes and focusing electrodes. The high voltages provide energy for e-fields inside the PMT that control the flow of electrons in response to impinging photons from a nearby photonic event. The PMT High Voltage Board also provides functional monitoring ports for diagnostic voltage measurements and an output circuit for extraction of the PMT analog signal from the PMT anode.
3.1.3Functional Block Diagram
The following block diagram illustrates the functional relationships of the PMT High Voltage Board with the DOM Main Board and the PMT in the IceCube system.
3.1.4Functional External Interfaces
The PMT High Voltage Board has six external functional interfaces:
- Power input from the DOM Main Board
- Bidirectional digital command, control, and monitoring to and from the DOM Main Board
- Analog anode signal input from the PMT
- PMT analog anode signal output to the DOM Main Board
- High voltage outputs to the PMT’s anode, dynodes, and focusing electrodes
- Structural mounting of the PMT HV Board by attachment to the PMT pins
These interfaces are illustrated in the figure.
3.2Performance Requirements
3.2.1Functional Requirements
3.2.1.1High Voltage Generation
The PMT High Voltage Board shall generate a series of high voltages for the individual dynodes, focusing electrodes and the anode of the PMT, using the power provided by the DOM Main Board.
REQUIREMENT’S SOURCE:
Preliminary Design Document (PDD), Section 7.2, Digital Optical Module
VERIFICATION METHOD:
Inspection
3.2.1.2PMT Signal Output
The PMT High Voltage Board shall transfer the anode signal pulses from the PMT to the DOM Main Board through a coaxial cable.
REQUIREMENT’S SOURCE:
Coaxial cable is a straightforward way of implementing an impedance-controlled transmission line that transfers the PMT pulses with high fidelity.
VERIFICATION METHOD:
Inspection
3.2.1.3Command Response
The PMT High Voltage Board shall respond to the digital control commands issued by the DOM Main Board for High Voltage on/off and for the adjustment of the high voltages.
REQUIREMENT’S SOURCE:
Preliminary Design Document (PDD), Section 7.2, Figure 65
VERIFICATION METHOD:
Test
3.2.1.4High Voltage Readings Output
The PMT High Voltage Board shall provide a digital reading output of the values of the high voltage to the DOM Main Board upon request.
REQUIREMENT’S SOURCE:
Document review ( and the subsequent telephone conference with [TBA] on October 3, 2002.
VERIFICATION METHOD:
Test
3.2.1.5Board Identification Output
The PMT High Voltage Board shall provide digital board identification information output to the DOM Main Board upon request.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Test
3.2.2Electrical Requirements
3.2.2.1Input Voltage
3.2.2.1.1+5 Volts DC
The PMT HV Board shall receive a power input voltage of +5 VDC ±5%.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Test
3.2.2.1.2–5 Volts DC
The PMT HV Board shall receive a power input voltage of -5 VDC ±5%.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Test
3.2.2.2Input Current
3.2.2.2.1+5 Volts Input Current
The PMT HV Board input current for +5 Volt power shall not exceed [TBD] mA.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Test
3.2.2.2.2–5 Volts Input Current
The PMT HV Board input current for -5 Volt power shall not exceed [TBD] mA.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Test
3.2.2.3Input Power
The total input power to the PMT HV Board shall not exceed 300 mW.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Test
3.2.2.4Internal Power Distribution
The PMT HV Board shall …
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD: Test Analysis Inspection Demonstration Similarity
{enter one of the above methods}
3.2.2.5Internal Grounds
3.2.2.5.1Analog Ground
The low noise analog signal ground shall be referenced by the voltage multiplier, dynode resistive divider, and regulator feedback circuitry.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Inspection
3.2.2.5.2Power and Digital Grounds
Power and digital grounds shall be as one on the PCB and connected to the DOM Main Board interface connector pin(s) designated as DGND; and, referenced by the digital control and monitor circuitry including the ADC and the DAC; and, referenced by the regulator and switching circuitry used for HV generation.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Inspection
3.2.2.5.3Split Power/Digital and Analog Grounds
3.2.2.5.3.1Isolated Grounds Configuration
The PMT HV Board shall have two isolated ground planes, a power/digital ground plane and an analog signal ground plane as illustrated in the figure below.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Inspection
3.2.2.5.3.2Isolation Resistance
The two ground planes defined above shall have a minimum isolation resistance of 10 M.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Test
3.2.2.5.3.3Stray Capacitance
The stray capacitance between the two ground planes shall be less than 50 pF.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Test
3.2.2.5.3.4Noise Tuning Grounds Interconnect Jumper
The PMT HV Board shall have solder pads for a solderable noise tuning jumper (a zero-ohm resistor) between the two ground planes.
- The PMT HV Board shall be delivered without the jumper installed.
- The installation of the optional noise tuning jumper during production at the next higher level of assembly shall be as determined using criteria set by IceCube Engineering.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Inspection
3.2.2.5.3.5Soldering Pad for Clean Analog Ground
The PMT HV Board shall have a wire soldering pad for the purpose of attaching a 20 AWG (0.52 mm2 conductor area) stranded wire for the “clean analog ground” connection to the DOM Main Board.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer}
VERIFICATION METHOD:
Inspection
3.2.2.5.4RF Grounds
The PMT HV Board shall ….
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD: Test Analysis Inspection Demonstration Similarity
{enter one of the above methods}
3.2.2.6PMT Cathode
3.2.2.6.1PMT Cathode Potential
The PMT HV Board shall provide a low impedance zero voltage for the PMT cathode.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Inspection
3.2.2.6.2PMT Cathode Ground Reference
The PMT HV Board shall provide a ground reference for the PMT cathode by direct connection of the cathode to the PMT HV Board analog ground.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD:
Inspection
3.2.2.7PMT Anode High Voltage Generation
3.2.2.7.1Adjustable Voltage Range
The PMT HV Board shall output a voltage that is adjustable over a minimum range of 1000 to 2000 Volts DC to be applied to the PMT anode.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD: Test Analysis Inspection Demonstration Similarity
{enter one of the above methods}
3.2.2.7.2Minimum Adjustment Voltage
The low end of the adjustable anode voltage range shall not be less than 800 VDC.
REQUIREMENT’S SOURCE: (What source did this requirement come from? Or, what is its justification?)
{enter the traceability answer here}
VERIFICATION METHOD: Test Analysis Inspection Demonstration Similarity
{enter one of the above methods}