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4800
Background Statement for SEMI Draft Document 4800
NEW STANDARD: GUIDE FOR SPECIFYING A PHOTOVOLTAIC CONNECTOR RIBBON
Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.
Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.
Background
There are several PV connector ribbon manufacturing companies serving the photovoltaic industry. All these companies manufacture ribbons according customer specifications but use different sets of parameters to characterize the ribbon.
This guide defines a set of parameters that allows ribbons manufactured by company (A) to be compared to ribbons manufactured by Company (B).
This is important to avoid ribbon performance differences in PV module processes. PV module manufacturers can expect to receive equalquality from different sources.
This guide also helps to create ribbon specifications for PV applications.
The ballot results will be reviewed by the PV Connector Ribbon TF and adjudicated by PV Committee during their meetings at Intersolar Europe on June 8-10, 2011 in Munich, Germany. Check for the latest schedule and meeting locations.
For question, contact
Christian Prischmann / Ulbrich
Kevin Nguyen / SEMI
James Amano / SEMI
SEMI Draft Document 4800
NEW STANDARD: GUIDE FOR SPECIFYING A PHOTOVOLTAIC CONNECTOR RIBBON
1 Purpose
1.1 This guide defines a set of parameters which sufficiently specifies a Photovoltaic (PV) connector ribbon.
2 Scope
2.1 This guide includes all parameters that are necessary to specify a PV connector ribbon sufficiently.
2.2 This guide provides all necessary information to create PV connector ribbon specifications.
2.3 This guide provides ribbon manufacturers all necessary information to manufacture PV connector ribbons according to a defined specification.
2.4 This guide allows PV module manufacturers to compare PV connector ribbons which are manufactured by different ribbon manufacturer companies.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.
3 Referenced Standards and Documents
3.1 ASTMStandards[1]
ASTM B170— Standard Specification for Oxygen Free Electrolytic Copper Refinery Shapes
ASTM B5— Standard Specification for High Conductivity Tough-Pitch Copper Refinery Shapes
3.2 DIN Standard[2]
DIN EN 13602 – Copper and copper alloys – Drawn, round copper wire for the manufacture of electrical conductors
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 A — elongation at rupture
4.1.2 Rm — tensile strength
4.1.3 Rp0.2— yield strength
4.2 Definitions
4.2.1 camber— the camber describes the ribbon straightness
4.2.2 copper core— the copper core is the base material of the connector ribbon without the solder coating
5 PV Connector Ribbon Characteristics and Parameters
5.1 The characteristics and parameters shown in table 1 are necessary to specify a PV connector ribbon.
Table 1PV Connector RibbonCharacteristics and Parameters
Characteristic / Parameter / UnitsBase material / Chemical composition of copper base material / According to DIN EN 13602 or ASTM B5 or ASTM B170
Electrical Conductivity of copper base material
Quality of base material (Rolled or Shaped)
Dimension of copper core / Width of copper core and tolerance range / mm
Thickness of copper core and tolerance range
Physical properties
of finished product / Yield strength Rp0.2 / N/mm²
Tensile strength Rm / N/mm²
Elongation at rupture A / %
Solder coating / Solder coating material / Composition in weight percentage
Solder coating thickness / µm
Quality of solder coating (Electro plated – Hot tip tinned – Clad)
Surface condition / Optical Appearance
Straightness / Camber / mm/m
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibility of the user. Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. These standards are subject to change without notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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[1] American Society for Testing and Materials
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Website:
[2] Deutsches Institut für Normung e.V.
Available from Beuth Verlag GmbH, Burggrafenstrasse 4-10, D-10787 Berlin, Germany, Website: