Scotch Weld Brand Bonding Tape Product

Scotch Weld Brand Bonding Tape Product

584

1. Product Description:

Bonding Film 584 is high strength, flexible, nitrile phenolic based thermoplastic

bonding film. It can be heat or solvent activated for bonding. Bonding Film 584 can

also be lightly crosslinked using a post heat exposure. This crosslinking will provide

additional heat and solvent resistance as well as somewhat higher shear strengths.

Bonding Film 584 must be stored at or below 4℃(40F) for maximum storage life.

2. Key Features

・  Flexible

・  Heat or solvent activation

・  Heat crosslinkable option

・  Can be die-cut

3. Construction

4. Over Lap Shear Strength (OLSS) of Bonds made at Various Temperatures

Bondline
Temp. / Time / OLSS
(N/cm2) / Bondline
Temp. / Time / OLSS
(N/cm2)
180deg. C / 30min. / 1420 / 120deg. C / 30min. / 980
5min. / 1420 / 5min. / 780
1min. / 1130 / 1min. / 740
10sec. / 540 / 10sec. / 590
160deg. C / 30min. / 1370 / 100deg. C / 30min. / 830
5min. / 1370 / 1min. / 590
1min. / 1030 / 10sec. / 490
10sec. / 830 / 80deg. C / 30min. / 590
140deg. C / 30min. / 1180 / 1min. / 490
5min. / 1030 / 10sec. / 390
1min. / 780
10sec. / 690

Test Method

Puressure: 49 N/cm2 Heat Press Tensile Speed: 5 mm/min.

Substrate: Aluminum Tensile at 25deg.C

Surface Treatment: MEK Wiped

5. Adheshion Strength Tested at Various Temperatures

Test
Temperature / OLSS (N/cm2)
(A) / (B)
0 deg.C / 390 / 1370
25 deg.C / 390 / 1370
40 deg.C / 290 / 1030
80 deg.C / 50 / 390
120 deg.C / --- / 130
160 deg.C / --- / 60

Substarate:Aluminum

Heat Condition: (A) 80 deg.C/10sec.,49N/cm2

(B) 160 deg.C/ 5min.,49N/cm2

Tensile Speed: 5 mm/min.

6. Adheshion to Various Substrates

Test
Substrate / OLSS (N/cm2)
(A) / (B)
Aluminum / 390 / 1370
Steel / 490 / 1470
Brass / 490 / 1570
Polystyrene / 100 / ---
Polycarbonate / 100 / ---
ABS / 170 / ---

Surface Treatment: MEK wiped(Metal substrate)

Alcohol wiped(Plastic substrate)

Heat Condition: (A) 80 deg.C/10sec.,49N/cm2

(B) 160 deg.C/ 5min.,49N/cm2

Tensile Speed: 5 mm/min.

7. Chemical Resistance

Before Heat / After Heat
MEK / Solve / Swell
Hexane / Non solve / Non solve
Toluene / Swell / Little swell
Ethanol / Little swell / Non solve
Water / Non solve / Non solve