Micropak PCB Manufacturing Capabilities

For a definition of terms and more information, check out our PCB Glossary.

File formats accepted at Micropak: Gerber with Excellon Drill file. All files should be sent in zip-format. A readme file is recommended.

Information highlighted in BLUEshould be in the board layout design to ensure a good working board.

Category / Description / Micropak Capability
Files can be / Gerber files-preferred format / 274-X ( embedded apertures)
Gerber files- acceptable format
Excellon Drill file / X and Y coordinates with tool sizes included
Material is FR4 / Bow and Twist / 0.2mm (0.0075”)
Dielectric Spacing / 0.125mm (0.005”) min
Starting Thickness / Within +/- 0.175mm(0.007”)
Layer Registration / Layer to Layer / Within 0.250mm(0.010”) (+/-0.125mm (0.005”) each layer)
Copper Plating / Minimum in holes / 20 micron(0.0008”)
Minimum on surface / 20 micron(0.0008”)
Inner Layers / Minimum clearances / Hole Size +0.65mm (0.025”)
Minimum back set / Copper 0.65mm(0.025”) from cut line
Minimum pad size / Hole size + 0.55mm(0.022”)
Minimum traces and spacing / 0.2mm (0.008”)
Outer Layers / Minimum back set / Copper 0.50mm(0.020”) from cut line
Minimum pad size (non-via) / Hole size + 0.50mm(0.020”)
Minimum via pad size / Hole size + 0.40mm(0.016”)
Minimum traces and spacing / 0.2mm (0.008”)
Multi Layers / 1-4 Layers / 0.8mm(0.031”),1.2mm(0.047”),1.6mm(0.062”),
2.4mm(0.093”),&3.2mm(0.125”) Thickness
35u(1oz), 52u(1.5oz), 87u(2.5oz)Finished Cu
5-8 Layers / 1.6mm(0.062”),2.4mm(0.093”),
& 3.2mm(0.125”) Thickness
35u(1oz), 52u(1.5oz), 87u(2.5oz)Finished Cu
Tracks / Finished Track Size / Within 20% of Artwork
Track Size 0.008”-0.009” / 35micron (1oz) finished Copper
Track Size 0.010”-0.013” / 35u(1oz), 52u(1.5oz) finished Copper
Track Size > 0.013” / 35u(1oz), 52u(1.5oz), 87u(2.5oz)Finished Cu
Solder Finish / Holes / Hot Air Leveling Used / 2.5micron (0.0001”) to 38micron (0.0015”)
Solder Filled Holes / Holes drilled 0.5mm or less, may be plugged
ENIG Finish / Electroless Nickel Thickness / 3 micron (0.00012”) minimum
Immersion Gold Thickness / 0.1micron (0.000004”) minimum
Finger Connector / Electroplated Nickel / 3 micron (0.00012”) minimum
Electroplated Gold / 0.75micron (0.00003”) minimum
Solder Mask / Mask Registration Tolerance / Within +/- 0.125mm (0.005”)
Nominal Thickness / 10 micron (0.0004”) minimum
Mask Film Clearance / Pad Size + Smallest Board Spacing
Silkscreen / Marking / Text / +/- 0.25mm ( 0.010”)registration
Minimum 0.2mm ( 0.008”) line required to be visible on board
Electrical Testing / Continuity / 10-50 ohm
Isolation / 10-100 Mohm
Voltage / 5V
Mimimum SMT Pitch / 0.5mm (0.020”)
Drilling / Drill Sizes from 0.5mm to 0.55mm
(Finished Size 0.4mm to 0.45mm) / 0.8mm, 1.2mm, 1.6mm thickness
Drill Sizes from 0.6mm to 0.65mm
(Finished Size 0.5mm to 0.55mm) / 0.8mm, 1.2mm, 1.6mm, 2.4mm thickness
Drill Sizes > = 0.70mm
(Finished Size >= 0.6mm) / 0.8mm, 1.2mm, 1.6mm, 2.4mm, 3.2mm thickness
Finished Hole Size / Within +/- 0.1mm(0.004”) of drill size. Please be aware that drill sizes of 0.5mm and below may plate shut.
True position / 0.125mm (0.005”)
Board Routing / Tolerance Board Edge and Cutouts / Within +/- 0.010”
Maximum board size / 560x406mm (22”x16”)
Minimum board size / 6.35x6.35mm (0.25”x0.25”)
Tab and Pallet Routing / Space between boards / 2.55mm (0.1”), minimum
Border around pallet / 12.5mm (0.5”), recommended
Number of tabs per board / 4
Maximum pallet size / 560x406mm (22”x16”)
Scoring / Space between Boards / 0.0
Border around pallet / 12.5mm (0.5”)
Maximum pallet size / 406x406mm (16”x16”)
Minimum board size / 38x38mm (1.5”x1.5”)
Minimum back set / Copper 0.75mm (0.030”) from cutline
Standards / IPC-600 Pictorial Guide / We use Classes 1, 2 and 3 to determine defects.