Wisconsin Center for Applied Microelectronics

1550 Engineering DrivePhone: 608/262-6877

Madison, WI 53706Fax: 608/265-2614

GENERAL PURPOSE SPINNER #1 & #3

OPERATING PROCEDURES

10/27/2018

Material Restrictions:

All materials allowed for use in this equipment are listed in PDF form on the WCAM My Web Space. To view the listing following these steps:

  1. Open the UW website for My WebSpace.
  2. Log on using your UW NetID and password.
  3. Click on the star in the upper left corner.
  4. Under Bookmarks click on Group Directories.
  5. Scroll down the list of organizations to WCAM.
  6. Click on WCAM.
  7. Double click on the first file folder to open “Approved Materials.”
  8. Double click on the WebsiteRpt to view the approved materials for equipment.
  9. Within the PDF you can perform a search.

Start of Operation

  1. Check spin bench out on CRESS.
  2. Select the correct size wafer chuck. Available are: 4-inch, 3-inch and piece.
  3. Push BLACK release button on spinner lid and gently lift lid to open position.
  4. Align the flat of the chuck washer to the flat of the spindle.
  5. Push the wafer chuck securely on the spindle shaft.
  6. Position wafer in the center of the chuck. Do not apply photoresist. This is a test to verify the programmed recipe steps. If the recipe has been altered, please contact staff to reprogram the recipe.
  7. Gently lower the spinner lid. Do not force.
  8. On controller press RECIPE + [number of desired recipe 0-9]

See chart for recipe parameters.

  1. To begin recipe program, press START button located on wet bench deck.
  2. After a successful test run, apply photoresist and press START button located on wet bench deck.
  3. At end of spin recipe program, push BLACK release button on spinner lid and gently lift lid to open position and remove wafer.
  4. Repeat recipe process until complete.

RECIPE

/ STEP 1 / STEP 2 / STEP 3 / STEP 4 / STEP 5 / STEP 6
0 -- Clean / 30 sec no PR
1000 rpm spin
1000/sec ramp / 30 sec
3000 rpm spin
1000/sec ramp / 0 sec
0 rpm spin
500/sec ramp
1 –
1500 / 3 sec
0 RPM
1000 Ramp / 30 sec
1500 RPM
10K Ramp / 0 sec
0 RPM
500 Ramp
2 –
2500 / 5 sec
500 RPM
500 Ramp / 30 sec
2500 RPM
3000 Ramp / 0 sec
0 RPM
500 Ramp
3 –
2500 / 10 sec
2500 RPM
250 Ramp / 20 sec
2500 RPM
250 Ramp / 0 sec
0 RPM
500 Ramp
4 –
500/3000 / 5 sec
100 RPM
100 Ramp / 7 sec
500 RPM
500 Ramp / 30 sec
3000 RPM
3000 Ramp / 0 sec
0 RPM
500 Ramp
5 –
5500 / 3 sec
0 RPM
1000 Ramp / 30 sec
5500 RPM
10K Ramp / 0 sec
0 RPM
500 Ramp
6 –
4000 / 3 sec
0 RPM
1000 Ramp / 30 sec
4000 RPM
5K Ramp / 0 sec
0 RPM
500 Ramp
7 –
2000 / 3 sec
0 RPM
1000 Ramp / 60 sec
2000 RPM
10K Ramp / 0 sec
0 RPM
500 Ramp
8 –
6000 / 3 sec
0 RPM
1000 Ramp / 30 sec
3000 RPM
500 Ramp / 0 sec
0 RPM
500 Ramp
9 –
4000 / 10 sec
500 RPM
500 Ramp / 30 sec
4000 RPM
1000 Ramp / 0 sec
0 RPM
500 Ramp

NOTE: Recipe development is by staff.

  1. After test run, push black release button on spinner lid and gently lift lid to open position.
    Do not force or handle the plastic safety shield.
  2. Remove test wafer and position the next wafer in the center of the chuck.
  3. Gently lower the spinner lid. Do not force or handle the plastic safety shield.
  4. Repeat recipe process until complete.

End

  1. Push black release button on spinner lid and gently lift lid to open position. Do not force or handle the plastic safety shield.
  2. Remove wafer.
  3. To clean bowl, place test wafer on chuck and close lid.
  4. On controller press RECIPE + 0 and START button located on wet bench deck.

RECIPE

/ PR / STEP 1
Spray acetone
Spray IPA / STEP 2
Spin Dry / STEP 3
Stop
0 -- Clean / none / 30 sec
1000rpm spin
1000/sec ramp / 30 sec
3000rpm spin
1000/sec ramp / 0 sec
0rpm spin
500/sec ramp
  1. While chuck is spinning, spray acetone on test wafer. Follow with an isopropanol spray.
  2. Allow spin drying.
  3. Open lid and remove test wafer and chuck.
  4. Store chuck in box located on bench deck. Do not remove chucks from this bench.
  5. Wipe out liner and bowl with cleanroom wipes.
  6. Log use.

PRspinners1&3.doc- 1 -