12518G SERVICE MANUAL

V1.0

WINGTECH GROUP INCORPORATION LIMITED

Documents statement:

l  This document is intended for use by qualified service personnel only.

l  The documents only are used for service reference.

TABLE OF CONTENT

Section page

1. Product Figures 5

1-1. Product Main Function 5

1-2. General Specification 6

2. Block Diagrams 7

2-1 BBIC Diagrams 7

2-2. Power Management Diagrams 9

3. Flow Chart of Troubleshooting 12

3-1.Baseband 12

3-1-1. Phone does not start up troubleshooting 12

3-1-2. SIM troubleshooting 15

3-1-3. MIC troubleshooting 17

3-1-4. T-Flash troubleshooting 19

3-1-5. Speaker troubleshooting 21

3-1-6. Earpiece troubleshooting 23

3-1-7. Camera troubleshooting 25

3-1-8. FM radio troubleshooting 27

3-1-9. Display troubleshooting 29

3-1-10. Bluetooth troubleshooting 31

3-1-11. Charge troubleshooting 33

3-2-1.GSM/DCS RX troubleshooting 35

3-2-2.DCS/GSM TX Part 37

4. Test Instructions 38

5. Glossary 39

6. Warnings and cautions 41

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1. Product Figures

1-1. Product Main Function

Ø  Support camera

Ø  Music player

Ø  Support T-Flash card

Ø  2.4" QVGA LCM

Ø  Support GSM900&PCS1800 Network

Ø  Support FM radio

Ø  Support dual SIM card

Ø  Support Bluetooth

1-2. General Specification

2. Block Diagrams

2-1 BBIC Diagrams

The typical application diagram is shown as in Figure.

2-2. Power Management Diagrams

The input of these linear voltage regulators is from the battery.

LDO Type:

3. Flow Chart of Troubleshooting

3-1.Baseband

3-1-1. Phone does not start up troubleshooting

Power-on Sequence and Protection Logic:

The PMU handles the powering ON and OFF of the handset. There are three ways to power-on the handset system :

1 Push PWRKEY (Pull the PWRKEY pin to the low level)

2 RTC module generate PWRBB to wakeup the system

3 Valid charger plug-in (CHRIN voltage is within the valid range)

Pulling PWRKEY low is the typical way to turn on the handset. The Vcore buck converter will be turned-on first, and then Va/Vio/Vm LDOs turn-on at

the same time. After that, the supplies for the baseband are ready and it will send the PWRBB signal back to PMU for acknowledgement. To successfully

power-on the handset, PWRKEY should be kept low until PMU receives the PWRBB from BB. Besides, the system reset ends at the moment when the

Vcore/Va/Vio/Vm are fully turned-on to ensure the correct timing and function.

If the RTC module is scheduled to wakeup the handset at some time, the PWRBB signal will directly control the PMU. In this case, PWRBB becomes

high at the specific moment and let PMU power-on just like the on-sequence described above. This is the case named RTC alarm.

Charger plugging-in will also turn on the handset if the charger is a valid charger. However, if the battery voltage is too low to power-on the handset

(UVLO state), the system won’t be turned-on by any of the three ways. In this case, charger will charge the battery first and the handset will be

powered-on automatically as long as the battery voltage is high enough.

Power ON/OFF circuit

BBIC POWER

Troubleshooting flow chart

Main related component: BBIC(U0101),NOR FLASH(U0500),XTAL CRYSTAL(X0201&X0400),KEYPAD&POWER KEY.

3-1-2. SIM troubleshooting

The SC6610 contains a dedicated smart card interface to allow the MCU to access. It can operate via 5 terminals, using SIMVCC, SIMSEL, SIMRST, SIMCLK and SIMDATA.

The SIMVCC is used to control the external voltage supply to the SIM card and SIMSEL determines the regulated smart

card supply voltage. SIMRST is used as the SIM card reset signal. Besides, SIMDATA and SIMCLK are used for data

exchange purpose.

SIM CIRCUIT

Troubleshooting flow chart

Main related component: BBIC(U0101),SIM connector

3-1-3. MIC troubleshooting

The voice uplink path, which is the interface between microphone (or other auxiliary input device) input and SC6610 DSP. A set of bias voltage is provided for external electret microphone.

MIC circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),MIC.

3-1-4. T-Flash troubleshooting

T-Flash circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),T-FLASH CONNECTOR(J6500) and T-FLASH card.

3-1-5. Speaker troubleshooting

Speaker circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),Audio PA(U3101),SPEAKER

3-1-6. Earpiece troubleshooting

Earpiece circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),SPEAKER

3-1-7. Camera troubleshooting

Camera circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),NOR FLASH(U0500),CAMERA CONNECT(J601),CAMERA MODULE.

3-1-8. FM radio troubleshooting

FM Circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),MINI USB(J6201),FM radio(U7100)

3-1-9. Display troubleshooting

SC6610 support MCU interface LCM, which is connected on external memory bus. And the LCM is also controlled by External Memory Controller.

Display Circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),NOR FLASH(U0500)and LCD.

3-1-10. Bluetooth troubleshooting

Bluetooth circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),XTAL CRYSTAL(X0201),BT MODEM(U8202),BT ANT(TP8201),BT FILTER(U8201).

3-1-11. Charge troubleshooting

Battery charge circuit

Troubleshooting flow chart

Main related component: BBIC(U0100),MINI USB(J6201),TROIDE-PNP(Q6100).

3-2. RF

3-2-1.GSM/DCS RX troubleshooting

RF Circuit

Troubleshooting flow chart

Main related component: BBIC(U0101),XTAL CRYSTAL(X0101),RF-PA(U0403),RX FILTER(U0400 and U0410),RF TR(U0404)

3-2-2.DCS/GSM TX Part

Troubleshooting flow chart

Main related component: BBIC(U100),XTAL CRYSTAL(X0400),RF-PA(U0403).

4. Test Instructions

Input “*#66# to enter the Auto MMI test mode:

1. Version

2. LCM/Keypad Backlight

3. LCD

4. Keypad

5. Receiver

6. MIC

7. Speaker

8. Headset

9. Vibrator

10. Melody

11. Camera

12. Memory Card

13. FM Radio

14. Torch light

15. Battery

16. Run Test

5. Glossary

6. Warnings and cautions

Warnings

l  If the device can be installed in a vehicle, Care must be taken on installation in vehicles fitted with. Electronic engine management systems and anti-skid braking systems. Under certain fault conditions, Emitted rf energy can affect their operation. If necessary, Consult the vehicle dealer/manufacturer to determine the immunity of vehicle electronic systems to RF energy.

l  The product must not be operated in areas likely to contain potentially explosive atmospheres, for example, Petrol stations(service stations),Blasting areas etc.

l  Operation of any radio transmitting equipment, Including cellular telephones, May inteerffer withthe functionality of inadequately protected medical devices. Consult a physician or the manufacturer of the menical device if you have any questions. Other electronic equipment may also be subject to interference.

l  Before making any test connections, Make sure you have switched off all equipment.

Cautions

l  Servicing and alignment must be undertaken by qualified personnel only.

l  Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

l  Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

l  Use only approved components as specified in the parts list.

l  Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and alignment.

l  Ensure all cables and wires are repositioned correctly.

ESD protection

l  Any product of which the covers are removed must be handled with ESD protection. The SIM card can be replaced without ESD protection if the product is otherwise ready for use.

l  To replace the covers ESD protection must be applied.

l  All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity discharge.

l  All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside any ESD Protected Area (EPA).

l  Every repair action involving opening the product or handling the product components must be done under ESD protection.

l  ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

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