Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone:408.943.6900, Fax: 408.943.7943
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Background Statement for SEMI Draft Document 5835
New Standard: SPECIFICATION FOR ADHESIVE TRAY USED FOR THIN CHIP HANDLING
Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.
Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.
Background
A variety of transportation trays or packages are being used as 3DsICs have become more common and IC chips thinner. Adhesive trays are considered effective since they can safely transport thin chips and have more flexibility for the quantity ofICs transported. Since no standards have been established for adhesive trays, development or modification of chip sorters and/or bonders will need to be adaptablefor any type of adhesive tray, which will raise the cost of manufacturing equipment. By standardizing the specification of adhesive trays, the cost of manufacturing equipment can be decreased and userefficiency improved. Through this standardization we hope to contribute to improvingthe supply chain.
The ballot results will be reviewed and adjudicated at the meetings indicated in the table below. Check under Calendar of Events for the latest update.
Information of TF Review and Committee Review
Task Force Review / Committee ReviewGroup: / Thin Chip Handling Task Force / JapanTC Chapter of Assembly & Packaging Global Technical Committee
Date: / TBD / Friday, October 16, 2015
Time & Timezone: / TBD / 13:00-15:00 [JST]
Location: / SEMI Japan, Ichigaya Office / SEMI Japan, Ichigaya Office
City, State/Country: / Tokyo, Japan / Tokyo, Japan
Leader(s): / Hideki Suzuki/ Shin-Etsu Polymer ()
HaruoShimamoto/ AIST ()
Standards Staff: / Chie Yanagisawa (SEMI Japan)
81.3.3222.5863 / / Chie Yanagisawa (SEMI Japan)
81.3.3222.5863 /
Task Force Review meeting’s details are subject to change, and additional review sessions may be scheduled if necessary. Contact the task force leaders or Standards staff for confirmation.
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 1Doc. 5835 SEMI
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone:408.943.6900, Fax: 408.943.7943
hb khghgh1000A5835
SEMI Draft Document 5835
New Standard: SPECIFICATIONFOR ADHESIVE TRAY USED FOR THIN CHIP HANDLING
1 Purpose
1.1 The purpose of this document is to establish astandard for the specification of adhesive trays for thin chip handling.
2 Scope
2.1 This document coversthin chip handling adhesive trays.
2.2 This document specifies the size and various properties of the adhesive trays.
2.3 This standard may be used as a specification for procurement of adhesive trays.
NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.
3 Referenced Standards and Documents
3.1 SEMI Standards and Safety Guidelines
None
3.2 ISOStandards[1]
ISO 2248:1985 — Packaging: Complete, Filled Transport Packages−Vertical Impact Test by Dropping
ISO 13355:2001 — Packaging: Complete, Filled Transport Packages and Unit Loads−Vertical Random Vibration Test
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 3DsIC—Three-dimensional stacked integrated circuit
4.2 Definitions
4.2.1 adhesive trays —trays which have adhesion layer to hold thin chips. Adhesive trays are used for manufacturing, shipping and storage of thin chips.
4.2.2 thin chip — IC chips equal to or less than 0.1 mm thickness.
4.2.3 adhesive strength —the measure of the maximum tensile stress needed to detach or unstick a chip from an adhesive tray[HS1]
5 Test Methods
5.1 Measurement
5.1.1 Adhesive tray dimensions―Use Vernier caliper or other measurement scale with the accuracy at least 0.05 mm.
5.1.2 Parallelismof adhesive surface — The parallelism shall be obtained by measuring nine different points (p1~p9) of an adhesive surface to the datum line 2. The points to be measured shall be at an arbitrary point within 10mm×10mm range, which is at the center, the four corners and the middle points of each edge. Obtain the difference (P) between minimum and maximum heights. See Figure 1.
Top view Side view
Figure 1
Measuring points of adhesive surface
5.2 Adhesive strength test
5.2.1 Apparatus ―For test apparatus, see Figure 2.
Figure 2
Schematic view of apparatus
5.2.1.1 Construction — Test apparatus (load cell), constant speed lifting and lowering apparatus, collet and base.
5.2.1.2 Collet —Used for suction contact or adherenceto hold a chip.
5.2.1.3 Size of collet —A collet which is the same size as or slightlylargerthan a chip shall be used. The collet shall not come into contact with the adhesive area of the tray.
5.2.2 Adhesive tray —Adhesive trays shall be fixed on the base with an appropriate method.
5.2.3 Chip — See Table 1.
5.3 Test Method
5.3.1 Pressing and Fixing Chip
5.3.1.1 Pressing — A chip shall be pressed to the adhesive surface of the tray and fixed by the collet. When pressing, the pressure [HS2]shall not be sufficient to damage the chip.
5.3.1.2 Pressure — The pressure shall be between 0.1 N/cm2 to 10.0 N/cm2.
5.3.1.3 Fixing — After pressing the chip, the collet shall be removed and the chip shall be fixed on a tray.
5.3.1.4 Settling time— After fixing the chip shall be kept on the tray for at least one minute.
5.3.2 Peeling
5.3.2.1 Collet position―Place the collet on the chip. Hold the chip by the collet. The chip shall be suctioned or adhered by the collet. See Figure 3 for side view and sizes.
Figure 3
Collet position
5.3.2.2 Suction power ―Suction power shall not be sufficient to damage the chip.
5.3.2.3 Peel off speed―Peel off the chip upwards at the speed of 300 mm/min.
5.4 Adhesive strength―The maximum load obtained at the time the chip is peeled off from adhesive tray is considered theadhesive strength.
5.5 Test condition — See Table 1.
Table 1Adhesive strength test conditions
Item / ConditionsChip / Mirror-polished silicon chip
Thickness: 0.05 mm
Size: 8 mm x 8 mm
Adhesive strength test position / Around the center of adhesive area
Measurements / Initial and one week after initial measurement
5.6 Stability of adhesive strength―Stability of adhesive strength shall be conducted using the following methods. See Figure 4 throughFigure 8.
5.6.1 Step 1 ―Five trays shall be used.
Figure 4
Measurement step 1
5.6.2 Step 2 ―placetwo chips on each adhesive tray.
Figure 5
Measurement step 2
5.6.3 Step 3 ―Measure the adhesive strength using one chip for each tray as the initial value at an initial value range between 15°C[J3] and 25°C.[HS4]
Figure 6
Measurement step 3
5.6.4 Step 4 ―Maintain the trays at 30°C, 70%RH (relative humidity)for a week.
Figure 7
Measurement step 4
5.6.5 Step 5 ―After one week, measure the adhesive strength using another chip as a one-week value.
Figure 8
Measurement step 5
5.7 Drop test —Place[HS5]chips on a tray and conduct a drop test in accordance with ISO 2248, Packaging - Complete, Filled Transport Packages - Vertical Impact Test by Dropping.
5.8 Vibration test —place chips on a tray and conduct a vibration test in accordance with ISO 13355, Packaging: Complete, Filled Transport Packages and Unit Loads−Vertical Random Vibration Test.
6 Requirements
6.1 Dimensional measurement — Specifications for two types: 2-inch and 4-inch traysas indicated in Figure 9 and Table 2.
Figure 9
Adhesive tray
Table 2Adhesive tray dimensions
Symbol / 2-inch type / 4-inch type / NotesDimensions
A / 51.0 0,-0.25 mm / 101.6 +0.1,-0.3 mm / External dimensions of tray
B / 51.0 0,-0.25 mm / 101.6 +0.1,-0.3 mm
C / 40.0 +5.0,-5.0 mm / 80.0 +5.0,-5.0 mm / Internal dimensions of tray (adhesive area)
D / 40.0 +5.0,-5.0 mm / 80.0 +5.0,-5.0 mm
E / 4.0 +0.1,-0.1 mm / 8.0 +0.1,-0.1 mm / Height of tray
F / 2.5－3.5 mm / 5.2－6.2 mm / Height from the bottom to adhesive layer
G / Need / Need / Layer C
(one corner of tray)
6.1.1 Parallelism of adhesive surface ―Specifications for two types: 2-inch and 4-inch traysas indicated in Table 3. This test may be conducted with ¶ 5.1.2.
Table 3Parallelism of adhesive surface
Symbol / 2-inch type / 4-inch typeP / ≤0.2 mm / ≤ 0.4 mm
6.1.2 Stability of adhesive strength―The ratio of theaverage initial value divided by the average one-week value shall be equal to, or less than, 5.0. This test may be conducted with ¶ 5.6.
6.2 Drop test —After dropping, chips shall be kept on the tray and shall not be damaged. This test should be conducted with ¶ 5.7.
6.3 Vibration test —After the test, chips shall be kept on the tray and shall not be damaged. This test should be conducted with ¶ 5.8.
7 Product Labeling
7.1 Product labeling―Adhesive trays that comply with this specification shall be identified by appropriate labeling(on thetray surfaceoutside the adhesive area). Identification should include at least the model name by printing, engraving or applying a seal on the surface of the tray outside the adhesive area.
NOTICE:SEMI makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice.
By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility.
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 1Doc. 5835 SEMI
[1] International Organization for Standardization, ISO Central Secretariat, 1, ch. de la Voie-Creuse, CP 56, CH-1211 Geneva 20, Switzerland; Telephone: 41.22.749.01.11, Fax: 41.22.733.34.30,
[HS1]修正案への変更をお願いします。
[HS2]pressurerへ変更をお願いします
[J3]Is this a range? Maybe say at an initial value range between 15°Cand 25°C?
[HS4]表現として分かりにくいようですので、an initial value range between 15°C and 25°C としてください
[HS5]5.6.2 は place に修正されているので、同様に place に修正